Laser direct structuring for 3D circuits
LPKF Fusion3D 1100 laser direct structuring creates three-dimensional circuits and laser-structuring of molded interconnect devices (MID) for small volume production. System is easy to install and can be incorporated into any work environment due to its compact size. Product has no restrictions in terms of 3D freedom and utilizes laser direct structuring technology (LDS) and MID to combine both mechanical structures and electronic circuits into a single 3D part. MID consists of circuit traces embedded into molded thermoplastics which creates an electrical pathway. The 3D circuits are structured by using LDS-grade resin which is laser activated by a scanner based laser system. The circuit pattern is written directly on the molded piece and conductive paths are plated using electroless plating technology, adhering only to where the plastic has been activated by the laser beam.