High thermal conductivity LED die attach adhesive suits small apps

ENGINEERED MATERIALS SYSTEMS CA-195 high thermal conductivity, low cost electrically conductive LED die attach adhesive for attaching LED and other small semiconductor die to silver and copper lead frames. Device is approximately half the cost of a pure silver filled die attach adhesive, has a high glass transition temperature (Tg) to facilitate wire bonding small die, low extractable ionics and high adhesion to silver and copper lead frames. Product has a dispense open time greater than 24 hours (measured as a 25% increase in viscosity), while maintaining optimized rheology for pin transfer or needle dispensing. The adhesive is ideal for small die thermal management applications.

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