High-reliability solder alloy boosts drop-shock performance

INDIUM SACM high-reliability solder alloy increases the drop-shock performance in portable electronics by 800%, without compromising on thermal cycling. Product is doped with manganese and contains less silver than other Pb-free alloys. The manganese provides increased strength, and the reduced silver content provides a more stable cost structure, especially beneficial for cost-sensitive applications. Product boosts stencil print transfer efficiency to work in the broadest range of processes.

http://www.indium.com/SACM