Electronic Products & Technology

High density RF interconnects are suitable for broadcast video

EP&T Magazine   

Electronics

SAMTEC HDBNC high density RF interconnects are suitable for broadcast video applications requiring high density panel arrays that result in additional strain on the interface due to ganged cabling. Devices are based on the familiar quarter-turn BNC coupling design, but with patented advancements permitting a four-fold increase in panel density compared to traditional BNCs, while maintaining the true 75 ohm performance and robust mechanical properties users expect from a BNC interface.

http://www.samtec.com

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