Desktop dispensing system handles underfill, dispensing

ANDA TECHNOLOGIES (USA) TSV Series desktop dispensing system is applicable for underfill, LENS dispensing, FPC package, SMT red glue dispensing, solder past dispensing, LED package, fingerprint identification module during SMT & pcb assembly, semiconductor package, electromechanical assembly and flat-panel-display assembly. Two models are available with different X-Y travel dimensions & numbers of platform : the TSV-300 model is 300 x 300mm and the TSV-400 model is 400 x 400mm.

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