Electronic Products & Technology

No-clean solder paste is ultra-fine

May 21, 2021  Stephen Law

MACDERMID ALPH ELECTRONICS Alpha OM-372 ultra-fine no-clean solder paste enables next generation high density assembly, designed for enhanced performance on assemblies with ultra-fine pitch components requiring improved stencil transfer efficiency and high electrical reliability, such as found in mobile and wearables, computing, and medical assemblies. Product provides best-in-class electrochemical reliability on fine pitch, low standoff components, requiring improved transfer efficiency and electrical reliability. Paste is formulated to deliver low post reflow residue and >1.66Cpk transfer efficiency process control on fine feature pads, as low as 80×130 um (008004).

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