Contactless connectivity solution eases device pairing, streamlines design engineering
EP&T Magazine
Electronics Interconnect connectivity connector Contactless Interconnect Molex SolutionMOLEX MX60 series of contactless connectivity solutions are low-power, high-speed, solid-state devices that feature miniaturized mmWave RF transceivers and built-in antennas in one complete package for faster, simpler, device-to-device communications without the use of physical cables or connectors. Solutions improve product design freedom, seamless device pairing and increased communications reliability for video displays, sleek and light consumer electronics, industrial robotics and devices operating in harsh environments. Product series is based on wireless chip-to-chip technology and more than 350 filed patent applications firm acquired in 2021 with the purchase of core technology and intellectual property from Keyssa Inc., a pioneer in high-speed contactless connectivity. The acquired technology operates at data rates from 1-to-5.4 Gbps on the 60 GHz band with no Wi‑Fi or Bluetooth interference.
