Conductive LED die adhesive attaches to silver, copper lead frames

ENGINEERED MATERIAL SYSTEMS CA-105 Low-Cost Conductive LED Die Attach Adhesive attaches LEDs and other small semiconductor die to silver and copper lead frames. Product is approximately half the cost of a pure silver filled die attach adhesive, has a high glass transition temperature (Tg) to facilitate wire bonding small die, has low extractable ionics and high adhesion to silver and copper lead frames. Product has a dispensing open time (pin transfer) greater than 24-hours (measured as a 25% increase in viscosity), while maintaining optimized rheology for pin transfer or needle dispensing. ENGINEERED MATERIAL SYSTEMS

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