Combined AOI and X-ray unit speeds up inspection

VISCOM X7056 FPD combined in-line 3D AXI/3D AOI system and in-line automatic X-ray inspection system is equipped with powerful digital flat panel detectors and X/Y stages, providing accurate planar 3D analysis of hidden fine-pitch solder joints such as µBGA, QFNs and stacked packages (PoP), achieving an immense improvement in X-ray image quality. System is optionally equipped with firm’s high-speed 3D XM camera module that delivers high resolution top-down and up to eight angular views. Fast shadow-free 3D automatic optical inspection (AOI) and simultaneous 3D automatic X-ray inspection (AXI) enable operators to reliably detect 100 percent of visible and hidden solder defects with highest flexibility at maximum throughput. http://www.viscom.com