Laser-based drilling, cutting unit handles flexible circuits

LPKF  MicroLine 5000 UV laser based flex drilling and cutting system is specifically tailored to the needs of the flexible circuit industry. Unit comes with a large working area of 21” x 24” and is available in two different laser power classes, depending on customer needs for various substrates and thicknesses. Product is equipped with precise process monitoring systems as well as intelligent vision systems for fiducial recognition and alignment. http://www.lpkfusa.com