3D AOI and 3D SPI systems boost speed, accuracy

SAKI 3D automated optical inspection (AOI) and 3D solder paste inspection (SPI) systems are fast and accurate, providing a choice of three resolutions-7μm, 12μm, and 18μm-and come in both single and dual lanes with platforms that handle board sizes up to 870mm width and inspect and measure components up to 25mm in height with 1µm resolution, practically eliminating escapes and false calls. An optical head and 6-stage ring lighting provide seamless illumination for all types of components, side cameras provide multiple vision angles, and circular lighting gives consistent illumination throughout the field of view. Systems capture clear, detailed images with no shadowing for inspection of the most challenging defects, such as non-wetting solder, lifted leads, tombstones, reverses, and height variations.