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DesignCon Call for Technical Papers, Tutorials


The International Engineering Consortium announces a call for papers for DesignCon 2009, to be held February 2-5 2009, in Santa Clara, Calif. Individuals presenting papers at DesignCon will join an elite group of technical leaders offering leading-edge case studies, technology innovations, practical techniques, design tips, and application overviews.
To submit a proposal

    * Prepare a 100 word abstract and 500-word summary
    * Complete the on-line submission form
    * Submission Deadline: August 15, 2008
Submissions will be reviewed based on quality, relevance, impact, and originality by the DesignCon 2009 Technical Program Committee.

Suggested topic categories include:

    * Chip-Level System Design
    * Functional Verification
    * IP Re-Use and Integration
    * System Co-Design: Chip/Package/Board
    * PCB and Passive Component Technology
    * High-Speed Parallel Interface Design
    * Multi-Gigabit Serial Interconnects
    * High-Speed Timing, Jitter and Noise

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