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BACKSIDE DIE MARKING SYSTEM

The WaferMark CSP200 backside die marking system uses laser technology to mark orientation and traceability information on each die on silicon wafers up to 200mm.


The fully automated, high throughput CSP200 provides high quality marks on a variety of wafer surface types. Highly accurate, the system is capable of marking die as small as 0.5mm in size, fulfilling the need for devices critical to the production of portable consumer electronic devices. Integrated mark inspection capability verifies the accuracy and quality of all marked die.
GSI Lumonics




News

BACKSIDE DIE MARKING SYSTEM

The WaferMark CSP200 backside die marking system uses laser technology to mark orientation and traceability information on each die on silicon wafers up to 200mm.


The fully automated, high throughput CSP200 provides high quality marks on a variety of wafer surface types. Highly accurate, the system is capable of marking die as small as 0.5mm in size, fulfilling the need for devices critical to the production of portable consumer electronic devices. Integrated mark inspection capability verifies the accuracy and quality of all marked die.
GSI Lumonics