Electronic Products & Technology

BACKSIDE DIE MARKING SYSTEM

The WaferMark CSP200 backside die marking system uses laser technology to mark orientation and traceability information on each die on silicon wafers up to 200mm.

January 17, 2005  Staff

The fully automated, high throughput CSP200 provides high quality marks on a variety of wafer surface types. Highly accurate, the system is capable of marking die as small as 0.5mm in size, fulfilling the need for devices critical to the production of portable consumer electronic devices. Integrated mark inspection capability verifies the accuracy and quality of all marked die.
GSI Lumonics


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BACKSIDE DIE MARKING SYSTEM

The WaferMark CSP200 backside die marking system uses laser technology to mark orientation and traceability information on each die on silicon wafers up to 200mm.

January 10, 2005  Staff

The fully automated, high throughput CSP200 provides high quality marks on a variety of wafer surface types. Highly accurate, the system is capable of marking die as small as 0.5mm in size, fulfilling the need for devices critical to the production of portable consumer electronic devices. Integrated mark inspection capability verifies the accuracy and quality of all marked die.
GSI Lumonics


Print this page

Related Stories

Leave a Reply

Your email address will not be published. Required fields are marked *

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