ENGINEERED MATERIAL SYSTEMS 535-18M-57 UV Cured Epoxy Adhesive is formulated for microelectronic assembly applications. This ultra-low stress, low shrinkage, ionically clean, low glass transition temperature UV cure adhesive eliminate any warpage of components in disk drive assemblies, lens bonding in camera modules, chip encapsulation in smart cards and a variety of general bonding applications in photonics assembly. The nonconductive UV cured adhesive cures rapidly when exposed to high-intensity UV light. 535-18M-57 is a low outgassing, extremely flexible, high strength epoxy adhesive that does not contain antimony.
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