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Tiny Bluetooth SoC targets next-gen wearables, IoT


NORDIC SEMICONDUCTOR nRF52832 Wafer Level Chip Scale Package (WL-CSP) high-performance single chip Bluetooth low energy SoC in a tiny package targets next-generation wearables and space-constrained IoT applications. Device has a super-compact 3.0 by 3.2mm footprint that occupies one quarter of the footprint area of firm’s standard 6 x 6mm QFN48-packaged nRF52832, yet offers the same full feature set. http://www.nordicsemi.com

16AUD233_WR1


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