Thermally conductive compound optimizes rheology in electronic apps

 DOW CORNING TC-5622 Thermally Conductive Compound improves thermal performance and stability against hardening or dry-out in end-use applications. Product’s optimized rheology eliminates the need for common solvent diluents in the formulation, which can evaporate over time. The proprietary filler in the product results in a material with high bulk thermal conductivity and the ability to achieve thin bond line thicknesses (BLTs). This ensures low thermal resistance in both thin and thicker BLT applications that demand high heat dissipation. Product has a relatively low specific gravity that results in a cost savings compared to many TIMs.

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