ECD M.O.L.E. MAP 3.00 thermal profiling software provides high levels of machine-assembly-process optimization. Function-rich and environment-adaptable product provides in-depth data and analysis capability within a highly versatile software platform that seamlessly integrates with all of firm’s profiling hardware. Product allows engineering specialists to utilize firm’s sensor inputs to its thermal profilers for operation within a unique environment, which is attuned to the specific profiling job. The software switches from one application to the next, allowing effortless transitions between wave soldering and reflow processes.
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