Electronic Products & Technology

Thermal management technology improves cooling, lightens enclosure

EP&T Magazine   


CURTISS-WRIGHT CONTROLS CoolWall technology for thermal management of rugged embedded computing enclosures improves payload power cooling when compared to traditional aluminum construction. This technology, based on a proprietary mixture of metal composite materials, delivers higher thermal conductivity at a weight significantly lighter than aluminum. Technology can be used both to improve thermal performance and reduce weight.



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