Thermal interface gaskets transfer heat from electronic components

FUJIPOLY AMERICA Die-cut thermal interface gaskets are an easy way to transfer heat from electronic components to the surrounding environment. When placed between a heat source and a heatsink, devices conform to all uneven surfaces and fill any air gaps. This significantly increases surface contact with the heatsink thereby increasing cooling efficiency. Product’s physical characteristics allow it to act as a low-pressure mounting cushion to prevent deformation. Devices provide a thermal conductivity between 0.9 and 17.0 W/m K with a thermal resistance between 0.03 and 3.47 Cin2/W.

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