FUJIPOLY Sarcon thermal interface materials are a gel-like sheet compound designed to efficiently transfer heat from its source to the nearby heat sink. Product’s physical properties allow it to protect delicate board-level components as they fill unwanted air gaps and levels uneven surfaces. The high-performance silicone based compound is available in nine thicknesses that deliver a thermal conductivity of 1.3 W/m K with a thermal resistance as low as .50C cm2/W.
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