INDIUM 10.5HF no-clean solder paste improves ICT first-pass yields. Product is specifically formulated to accommodate the higher processing temperatures required by SnAgCu, SnAg, and other alloy systems favored by the electronics industry. Product has a soft, pliable, non-tacky residue that minimizes build-up on probes during in-circuit testing and increases first-pass ICT yields.
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