INDIUM SACM high-reliability solder paste increases the drop-shock performance in portable electronics by 800%, without compromising on thermal cycling. Product is doped with manganese and contains less silver than other Pb-free solder pastes. The manganese provides increased strength and the reduced silver content provides a more stable cost structure, especially beneficial for cost-sensitive applications. The platform consists of Indium8.9 Series solder pastes using firm’s patent-pending SACM solder paste technology for board-side interconnect and SACM solder balls (spheres) for package-level interconnect.
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