Solder-on OSM size-S modules are based on i.MX 93 applications processors
EP&T Magazine
Electronics Embedded Systems Semiconductors Avent computing embedded Modules OSM semiconductorsAVNET EMBEDDED Compact MSC OSM-SF-IMX93 OSM computing modules are compliant with the new OSM* 1.1 standard (Size-S) ‘Small’ with dimensions of 30 x 30mm. The scalable standard module family integrates i.MX 93 applications processors from NXP Semiconductors. Modules housed in a pre-tinned LGA package can be soldered directly to the pcb and are suited for fully automated soldering, assembly and testing processing. By reducing the number of production steps and eliminating the cost of a connector, significant cost savings can be achieved compared to existing module form factors. The solder-on modules are optimized for large quantities. The compact module family is mainly used in industrial low-power applications that are cost-sensitive or need small dimensions.
