Silicone thermal interface material increases thermal management options

NUSIL TECHNOLOGY EPM1-2493 low-viscosity, low modulus silicone elastomer with a nominal thermal conductivity of 1W/mk, provides bond lines as thin as 5 microns. Product can be used to adhere materials with differing coefficients of thermal expansion (CTE) for significant stress reduction during thermal cycling. A low volatility elastomer, product can reduce or even prevent contamination of electronic device components used in applications exposed to high heat, such as solder reflow at 260C. Product adheres well to aluminum, and its adhesive strength can be improved with the use of a primer, achieving average lap shear values of120 psi (0.8 MPa).

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