Press-fit terminal power modules automate installation process

MICROCHIP TECHNOLOGY SP1F and SP3F highly configurable SP1F and SP3F press-fit terminal power modules automate the installation process, providing a solder-free solution when mounting to the pcb. Devices allow for automated or robotic installation, simplifying and speeding up the assembly process – reducing manufacturing costs. The high accuracy of the terminal locations enables high-reliability contact with the printed circuit card. Product portfolio includes more than 200 variants, with options to use mSiC technology or Si semiconductors and an array of topologies and ratings. Products come in voltage range of 600V-1700V and up to 280A.

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