Electronic Products & Technology


Peelable TIM formulation simplifies assembly rework

HENKEL Bergquist TGF 1500RW gap filler material provides the rare advantage of thermal interface material (TIM) reworkability without sacrifices in thermal conductivity or automation performance. Product extends even greater process flexibility and post-assembly adaptability. Material is a one-part, cure-in-place liquid gap filler allowing use with automated dispensing equipment for high-volume manufacturing operations.  Because the material is applied as a liquid, it is ideal for miniaturized, high-density assemblies and complex architectures, penetrating small gaps for complete coverage. Once cured, the material provides optimized surface contact and thermal transfer with a 1.5 W/m-K thermal conductivity.

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