Non-conductive, high thermal die attach paste delivers automotive grade reliability

HENKEL LOCTITE ABLESTIK ABP 8920TC high reliability, non-electrically conductive material more than doubles the thermal conductivity of its predecessor, providing systems designers and semiconductor specialists with an effective solution for packages that require high heat dissipation.  The material is well-suited for automotive and industrial applications, modules and sensors and 5G telecom devices. Product is built on firm’s high-performance, proprietary BMI resin system and formulated with a tightly-controlled maximum particle size and distribution to ensure excellent electrical isolation and lower CTE (CTE2 above Tg of 54ppm/°C). At 3.0 W/m-K, product is a thermally capable non-electrically conductive die attach paste. Product provides wide application adaptability, compatible with die sizes as large as 6.0mm x 6.0mm and delivering good adhesion on multiple leadframe finishes including Cu, Ag and PPF. 

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