Electronic Products & Technology

Nanosilica filled compound provides UV, heat-curing mechanism

Stephen Law   

Electronics Production / Materials Engineering Supply Chain nanosilica nanosilica compound

MASTER BOND UV22DC80-10F single component, nanosilica filled compound provides a UV and heat curing mechanism. The thixotropic, moderately low viscosity compound has a viscosity of 8,000-12,000 cps at 75°F (~23°C). Product improves dimensional stability and physical strength properties. The optically clear product provides the ability to be cured in shadowed out areas. Product cures in 10-30 seconds at 365nm with 10-40mW/cm2 of UV output, followed by a post cure at 180°F (~80°C) for 30-60 minutes.


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