SAMTEC Z-Ray one piece arrays are ultra-low profile, high density and highly customizable. The compression contact arrays are used as interposers or as board level interconnects. Compared to standard interposers, devices provide improved density, X-Y-Z axes flexibility, customizable shapes and patterns, increased cycle life, low normal force with high deflection range and 28+ Gbps performance. The 1mm pitch arrays (ZA1 Series) expand the Z-Ray interposers product line with the choice of dual compression contacts or single compression with solder balls.
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