KatioBond light curing product lineup has been engineered specifically for exceptionally fast seal-bonding functions in the production of microelectronics. Curing to initial strength in seconds with easy dispensability, products are developed as a highly reliable and cost-effective alternative to more complex heat-curing or two-component epoxy resins that require a large oven. Adhesives do not require a toxic solvent to adjust viscosity properties. Products are solvent free , require no mixing and are available with various viscosities, enabling the selection of the appropriate flow characteristic from capillary to steady.
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