Electronic Products & Technology

Joint-enhanced flux serves fine-pitch assembly, LED die attach

November 29, 2020  Stephen Law

SHENMAO AMERICA SMEF-Z3 joint-enhanced, no-clean flux is designed for fine-pitch assembly and LED die attach. Product is compatible with solder paste and can be applied after solder paste printing and cured simultaneously during reflow process. The cured flux enhances solder joint reliability. Product can be used for pin-transfer and stencil printing processes. 

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