Interconnect systems increase density, simplify pcb design
EP&T MagazineElectronics Interconnect assembly cable connector Interconnect Samtec wire
SAMTEC Optical FireFly Micro Flyover interconnect system provides the flexibility to use micro-footprint high-performance optical and copper interconnects interchangeably. Consisting of a transceiver, two-piece connector system, and cable, system supports 14, 16, 25, and 28 Gbps designs in x4, x8, and x12 configurations. These products are supported by 3D models, a PCI Express-over-Fiber adaptor card, and evaluation kits available.
Well suited for use in high-performance designs such as AI/high-performance computing, medical, test & measurement and FPGA applications, model ECUO FireFly Active Optical Micro Flyover System cable assembly supports up to 56 Gbps PAM4 SerDes and is designed for near package placement. An extended temperature version (model ETUO) for military, aerospace and industrial applications, operates across -40°C to +85°C and demonstrates error-free transmission during applied external shock and vibration tests methods specified in MIL-STD-810.