FUJIPOLY AMERICA Sarcon XR-Pe 1.0 mm thick sheet.of Highly Conformable TIM provides thermal conductivity of 11 W/m K (ASTM D 5470) with a thermal resistance as low as .06 Cin2/W. The silicone-based material easily conforms to most CPU and semiconductor shapes with a very low compression force requirement. The soft-touch characteristic is maintained for applications that require material compression from 30% up to 90%. Product can be used in applications with temperatures ranging from -40 to +150C. Product improves semiconductor performance by efficiently transferring unwanted heat to a nearby heat sink.
FUJIPOLYAMERICA
Sarcon XR-Pe 1.0 mm thick sheet.of Highly Conformable TIM provides thermal conductivity of 11 W/m K (ASTM D 5470) with a thermal resistance as low as .06 Cin2/W. The silicone-based material easily conforms to most CPU and semiconductor shapes with a very low compression force requirement. The soft-touch characteristic is maintained for applications that require material compression from 30% up to 90%. Product can be used in applications with temperatures ranging from -40 to +150C. Product improves semiconductor performance by efficiently transferring unwanted heat to a nearby heat sink.
