High current, small-scale spring-loaded pins serve 6-amp applications
MILL-MAX Spring-loaded pins boost current carrying capacity in a small form factor, making them suitable for charging applications, as well as for directly delivering power via cable or board-to-board interconnects. The reduced size makes them attractive for use in low profile and dense packaging designs. Products are available in three different termination styles: surface mount, through-hole, and solder cup. All three meet two of the most demanding requirements designers carrying capacity of 6 amps (@ 30˚C Temperature rise) with an above-board height of just 5.2mm for the surface mount and through-hole versions. The solder cup version has a total length of 9.5mm, all have a maximum diameter of 2.1mm. Devices have more mass and greater contact surface area between the components, resulting in lower overall bulk resistance, more efficient heat dissipation and electrical conductivity, all while delivering smooth operation throughout the stroke of the pin. Devices also have gold plating on all components; cycle life rating of 1,000,000 at half stroke; contact resistance of 20m-ohms max. and spring force of 60 grams at mid stroke .7mm.