Electronic Products & Technology

Header strips, solder tail socket strips connect in triple row

EP&T Magazine   


MILL-MAX 804 and 805 series interconnects provide triple row pin field allowing signal connections to be more densely packaged. Placing and soldering one connector rather than three SIP sockets or a single and double row combination increases assembly efficiency and improves positional accuracy. This triple row package, on .100″ (2.54 mm) grid, is available from 9 to 96 position configurations (ordered in increments of 3.)



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