Glass reinforced thermoset bonding material has multiple thickness options
Stephen LawElectronics Production / Materials bondply Circuit materials protection thermoset
ROGERS RO4450T thermoset bondply is a spread glass reinforced bonding material that comes in seven thickness options ranging between 0.0025” (0.064mm) and 0.006” (0.152mm), improving flexibility for high multilayer board count designs. Products are developed for wireless circuit designers looking for a better performing and more reliable alternative to FR-4 materials. The thermosetting hydrocarbon ceramic resin system facilitates a high post cure Tg, making the materials suitable for multilayers requiring sequential laminations as fully cured RO4400 bondplys are capable of handling multiple lamination cycles.