Glass bubbles speed, improve design of 5G infrastructure, devices
3M High-strength hollow Glass Bubbles product line provides a low-loss high speed high frequency (HSHF) resin additive for composite materials that designers used to build 5G devices and assemblies. Product helps designers enable products that can meet the rigorous transmission requirements and increased power demands that come with 5G implementation, while lowering the per volume cost of raw materials. Product enables designers of HSHF copper clad laminate (CCL) to produce smooth, lightweight 5G substrates for building printed circuit boards (pcbs) – the building blocks for 5G wireless radio systems. Product can also be used in plastic composites that a 5G signal transfers through, such as base station assemblies, radome shells, or even mobile phone cases.