FUJIPOLY SARCON SPG-50A form-in-place thermal compound delivers a thermal conductivity of 5.0 W/m K. The silicone-based compound exhibits ultra-low compression force making it suitable for applications that have delicate components or low compression requirements. Material fills large gaps around fragile circuit board solder points without causing damage or loss in performance and efficiently transfers heat from any board-level source to a nearby heat sink or heat spreader. Product will not cause corrosion on metal surfaces, and maintains all initial properties across a wide temperature range (-40C to + 150C). Product is available in easy-to-use tubes or syringes.
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