Circular MT connectors boost density for next-gen embedded systems
EP&T MagazineElectronics 87 circular connector embedded High-density Interconnect MT systems TE Connectivity VITA
TE CONNECTIVITY VITA 87 High Density Circular MT Connectors feature 12 to 24 fiber options, housing up to 96 fibers within a compact size 15 shell with 4 MTs – a stark contrast to the J4 interconnect in SOSA open systems architecture, which fits 11 fibers in a larger size 19 shell. Product line helps enable next-generation systems to meet stringent size, weight and power requirements while supporting the high bandwidth needs of emerging data-intensive capabilities. Products meet the VITA 87 and the SOSA Technical Standards and are available in both physical contact and lensed versions. Devices cater to a diverse array of high-density applications, with versatility that extends from MIL fiber optics cable assemblies to optical add-on and option cards, as well as to a range of ruggedized uses involving the MIL-STD 38999 interface.