Board-to-board RF coaxial interconnects serve telco apps
RADIALL Board-to-board RF coaxial interconnects serve telco apps
SMP-MAX, SMP-Spring, IMP-Spring range of cost effective board-to-board, module-to-module and panel-to-panel RF coaxial interconnect solutions serve the telecom industry. Devices address demanding wireless telecom applications required for the new generation of infrastructure compact equipment such as base stations or handhelds. Devices provide a patented impedance matching insulator that is optimized for a larger operating gap between connectors making it easier to handle a maximum board-to-board distance tolerance of up to .078 (2 mm) gap without a spring. Product has a 3-degree tilt (radial travel) and an operating frequency range of 6GHz dc, a 1.2 max VSWR guaranteed up to 3GHz and it can handle up to 165Watts of power at 3GHz.