Benchtop systems provide IC temperature testing

INTEST THERMAL SOLUTIONS Temptronic ThermoSpot benchtop systems for temperature testing integrated circuits including high-Watt emitting devices consists of a highly responsive benchtop temperature forcing unit that feeds a thermal probe head through a flexible umbilical. The thermal probe is designed with an interchangeable ThermoBridge to mate directly to an IC or other device under test creating a highly efficient thermally conductive path to quickly induce temperatures to the device, even under power. Interfacing to the DUT is available for in-circuit and test socket applications. Connecting the thermal head to the DUT is made easy and precise through a quick lock-down mechanism on the thermal head.