5G MIMO modules utilize top-side cooling tech
EP&T MagazineWireless 5G MIMO Modules semiconductors wireless
NXP family of 5G massive MIMO modules utilize firm’s top-side cooling package technology. Products are designed for 32T32R 200 W radios, covering 3.3GHz to 3.8GHz frequency bands and leveraging the latest proprietary GaN technology manufactured in firm’s fab in Chandler, AZ. Smaller, thinner and lighter systems will enable significant cost savings, plus more environmentally friendly base stations, while achieving the full performance benefits of 5G. The two-stage fully integrated Doherty PA module provides a 30% radio thickness and weight reduction. Devices deliver separation of thermal management from the RF path, while providing a 30% radio thickness and weight reduction.