Electronic Products & Technology


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Product
February 1, 2010 by EP&T Magazine

In-line process system inspects SMT reflow ovens

KIC Thermal Reflow Process Inspection (RPI) in-line process inspection system for SMT reflow ovens. System is embedded inside the reflow oven and checks the profile for each and every product processed through the oven to verify whether the profile is…
News
January 31, 2010 by Staff

COM DEV wins commercial contract

COM DEV International Ltd. announced that it has been awarded a contract valued in excess of US$7 million to provide passive microwave equipment for a commercial communications satellite. COM DEV will supply switches, filters and multiplexers for use on the spacecraft.
News
January 31, 2010 by Staff

Motor solves challenges for robust, high temperature applications

BEI Kimco Magnetics recently met the challenging high-performance motor requirements for a Down Hole Measurement While Drilling (MWD) application. With oil companies drilling deeper than ever before to obtain increasingly valuable deposits, components within the drill tool must deliver reliable…
Product
January 29, 2010 by EP&T Magazine

Indium phosphide chipset elevates next-Gen, high-bandwidth, real-time oscilloscopes

Agilent next-generation, high-bandwidth oscilloscopes with turn-on of a front-end chipset, uses indium phosphide (InP) technology, which permits oscilloscopes to offer true analog bandwidths greater than 16GHz. Engineers working with high-speed serial data links such as USB, SATA or PCI Express(r)…
Product
January 29, 2010 by EP&T Magazine

Current sensor IC solves high voltage isolation needs

Allegro ACS710 120kHz bandwidth, high-voltage isolation current sensor IC provides an economical and precise means for current sensing applications. Device provides a small footprint surface mount package that eases implementation. Device consists of a precision linear Hall sensor integrated circuit…
News
January 28, 2010 by Staff

TI Class-D audio amplifiers

Texas Instruments Inc. has introduced two new Class-D audio amplifiers designed to advance the home entertainment experience. Capable of driving 600 W, the TAS5630 and TAS5631 feature the highest stereo output power in the industry, more than twice that of…
Product
January 28, 2010 by EP&T Magazine

UPS modules minimize downtime

WAGO 787 Series UPS Controller (and batteries), as well as buffer and redundancy modules to firms power supply line minimize downtime by shielding complex automation systems and components from common disturbances (e.g., voltage fluctuations, harmonic distortion and outages). Encapsulated in…
Product
January 28, 2010 by EP&T Magazine

Front end rectifier achieves 90% efficiency

Lineage Power 2000 Watt CAR2024FP front end rectifier intended for 24 volt (V) and 28V applications, can achieve 90% efficiency at 100% of load to meet and exceed application-orientated efficiency standards such as the 80 Plus(R) Bronze Standard, ENERGY STAR,…
News
January 28, 2010 by Staff

TI delivers industry's highest power, integrated Class-D audio amplifiers

Texas Instruments Inc. has introduced two new Class-D audio amplifiers designed to advance the home entertainment experience.
Product
January 27, 2010 by EP&T Magazine

LED lighting power modules deliver wide input voltage range

Power Partners PIL100 Series of 100W LED lighting power modules with a choice of constant current or constant voltage models. Units provide a wide input voltage range that accepts up to 305Vac. Output on the constant current models ranges from…
Product
January 27, 2010 by EP&T Magazine

Solid-state CompactFlash card suits industrial applications

TRI-M SYSTEMS innoDisk iCF8000 series Industrial CompactFlash card is a best-in-class 4-channel embedded solid-state CompactFlash that provides high sustained read and write speeds up to 80MB/sec and 75MB/sec with full support of PIO 0-4/Multiword DMA 0-2/Ultra DMA 0-6 modes .Device…
News
January 27, 2010 by Staff

1 kW low-profile power supplies

TDK-Lambda has introduced the RFE1000 series; a 1kW single-output AC-DC power supply in an ultra low profile (only 1.61" high) 1U package for stand alone or distributed power architectures (DPA).