DRAM addresses rapidly growing market demand

SAMSUNG SEMICONDUCTOR 8-gigabyte (GB) High Bandwidth Memory-2 (HBM2) DRAM with 256GB/s memory bandwidth meets growing market needs across a wide range of applications including artificial intelligence, HPC (high-performance computing), advanced graphics, network systems and enterprise servers. Product consists of eight 8-gigabit (Gb) HBM2 dies and a buffer die at the bottom of the stack, which are all vertically interconnected by TSVs and microbumps.