May 12, 2021

TECHNICAL WEBINAR

Conductive Copper Inks: Revolution in Printed Electronics

Organized by the intelliFLEX Innovation Alliance
May 12, 2021
12:00-1:00 p.m. EST

In this presentation, we will review Copper pastes, which are superior to silver pastes and to etching techniques. These pastes are suitable for various substrates such as Paper, PET, PI, Glass, Aluminum, Alumina, FR4, silicon wafers and photovoltaic wafers. We will review different applications such as printed antennas, heaters, flexible circuits, PCBs, and displays. We will demonstrate that a very high level of conductivity can be obtained with Copprint’s Nano-Copper pastes while dramatically reducing costs and using simple low-cost equipment and under-air processing. All our Copper inks are commercially available for purchase.

Speaker:

Dr. Ofer Shochet, Co-Founder & CEO, Copprint

Dr. Ofer Shochet is an entrepreneur and a technology visionary, specializing in the development and successful implementation of future technologies in various companies at various fields of technologies. Ofer is the founder of Copprint and serves as a Board member at Velo 3D and Saccade vision.