April 06, 2021

Next Generation Lead Free Solders for High Reliability and SMT Yield improvement in Client Computing Systems

he webinar will be on Tuesday, April 6th at 12:00 PM EST and will discuss the evolution of lead free (Pb-free) solder, from tin-silver-copper (SAC) system with silver content of 3.0 and 4.0 to low SAC solders and the emergence of high reliability Pb-free solder. It will cover the reasons and the driving forces of industries implementing this change.

The solder composition has evolved further recently to fulfill high reliability requirements of certain sectors such as automotive, aerospace, and military which are preparing to utilize lead free solder technology. This kind of high reliability solder involves additional microalloying of tin (Sn)-based solder in making it to be more robust. This presentation will discuss 2nd and 3rd generations solders used to enhance the Pb-free solder strength and the reliability associated with each system.

Dr. Nathan Blattau, Distinguished Engineer at Ansys, has been involved in the simulation and reliability of electronic equipment for over twenty years.  Prior to joining Ansys, Dr. Blattau was the Vice President and Chief Scientist of DfR Solutions.  He holds two patents and has authored over 20 papers and has presented on a wide variety of reliability issues within the electronics industry.  His specialties include best practices in design for reliability, robustness of Pb-free, failure analysis, accelerated test plan development, nonlinear finite element analysis, and solder joint reliability. Dr. Blattau holds a Ph.D. in Mechanical Engineering, an M.S. in Mechanical Engineering, and a B.S. in Civil Engineering from the University of Maryland.

This webinar is FREE for SMTA members and $15 for non-members.

To RSVP, please click here.