January 25 - January 26, 2023
Conference & Exhibition
The First Annual Chiplet Summit is the show chip designers can’t miss if they want to stay competitive. They’ll get the scoop on ways to make their chiplets run faster, scale better, use less power, and be more flexible. This unique event gives attendees a place to network with peers, ask questions of the experts, and talk to vendors offering a wide variety of products and services.
The summit will cover:
- the latest architectures,
- development platforms and methods, and applications.
- all aspects of chiplet development, including partitioning, design, interconnect, power and thermal analysis, packaging, integration, and test.
- new methods such as 3D heterogeneous integration and wafer-level, 2.5D, and 3D packaging
-
Yole Group will be part of the speakers with:
Tom HACKENBERG,
Principal Analyst, Computing and Software
Yole Intelligence part of Yole GroupWednesday, January 25th,
Session: Chiplets: where we are today
09:00am – 10:00am: Chiplets Market UpdateThursday, January 26th,
Panel: Chiplets in 2028 and How We Got There
03:30pm – 04:30pm
John LORENZ,
Senior Technology & Market Analyst, Computing and Software
Yole Intelligence part of Yole GroupMore info coming soon
https://chipletsummit.com/
Print this page
