Synopsys and Arm push on with next-gen mobile SoC designs
Stephen LawElectronics Semiconductors semiconductor SoC
Synopsys has announced that it is combining EDA and IP with Arm’s Total Compute Solutions at Computex Taipei. The AI-enhanced design collaboration tackles mobile chip designs on advanced nodes down to 2nm.
At the show, Synopsys announced Synopsys.ai full-stack AI-driven EDA suite, Synopsys Interface and Security IP and Synopsys Silicon Lifecycle Management PVT IP have been optimized for the highest levels of performance and power for Arm’s latest compute platform. These advancements continue the decades of collaboration between the two companies to accelerate customers’ delivery of Arm-based SoCs for smartphones and VR / AR applications.
Shankar Krishnamoorthy, general manager of Synopsys EDA group, commented: “Collaborating with Arm to optimize our EDA and IP solutions enables mutual customers to tackle some of the toughest multi-die system integration challenges from design, IP integration and verification to software development. The addition of the Synopsys.ai EDA suite starts a new phase, where co-operative keystone companies, like Synopsys and Arm, align expertise to help mutual customers turbo-charge the delivery of their Arm-based SoC designs.”
Arm announced its Total Compute Solutions 2023 (TCS23) platform, which delivers a suite of segment-specific technology, designed with the system in mind, so that our customers can tap into the compute performance required for the next generation of visual computing experiences, according to Chris Bergey, senior vice president and general manager, client line of business, at Arm.
For TCS23, the Synopsys.ai full-stack AI-driven EDA suite leverages the power of AI from system architecture through manufacturing to optimize power, performance and area (PPA) and enhance time to market, said the company.