UV laser depaneling systems process pcbs

LPKF MicroLine 2000 Series of UV laser cutting systems for printed circuit board depaneling meets rigorous standards of modern circuit depaneling. Unit benefits from a low-stress UV laser source, which provides two main advantages: the elimination of mechanical stress and the ability to process a wide variety of circuit materials, including flexible, rigid, and rigid-flex substrates. Product is available in either stand-alone or inline configuration. Systems can also be equipped with either a 6 or 12 watt laser source to match user application requirements.

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